USB3.1 Type-C Menegak Dip tanpa PEGS
$500≥1000Piece/Pieces
Jenis bayaran: | L/C,T/T,Paypal |
Incoterm: | FOB,CIF,EXW |
Pesanan minimum: | 1000 Piece/Pieces |
Pengangkutan: | Ocean,Air,Express |
Port: | Shenzhen |
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$500≥1000Piece/Pieces
Jenis bayaran: | L/C,T/T,Paypal |
Incoterm: | FOB,CIF,EXW |
Pesanan minimum: | 1000 Piece/Pieces |
Pengangkutan: | Ocean,Air,Express |
Port: | Shenzhen |
Model No.: U3.1MS05-SLXXX
Jenama: Antenk.
Tempat Asal: China
Unit Jualan | : | Piece/Pieces |
Jenis Pakej | : | Pembungkusan beg, pembungkusan tiub, pembungkusan reel |
Muat turun | : |
USB3.1 Palam Jenis C Menegak Dip Tanpa PaGs
Spesifikasi.
1.Material:
Molding: LCP UL94V-0
Hubungi: Aloi Tembaga
Emas bersalut Min di kawasan sentuhan, 100U "min timah (plumbum percuma), di kawasan solder
Shell: sus304-h, t = 0.30 ± 0.03mm 50u "penyaduran nikel atas semua
Shild: SUS304-H, T = 0.12 ± 0.03mm
2.Mechanical:
Penyisipan: 5-20n.
Pengekstrakan: 8-20n selepas ujian
Ketahanan: 10000 CYCLES
3.Electrical:
Penilaian semasa: 5A untuk VBUS
1.25a untuk PIN GND
0.25a untuk yang lain
Voltan: 20V Maks
Hadapan Voltan: 100V AC RMS
Hubungi Rintangan: 40mω Maks
Rintangan penebat: 100mω min
4.Environmental:
Julat suhu: -30 ℃ ~ + 85 ℃
Lukisan 2D:
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Privacy statement: Your privacy is very important to Us. Our company promises not to disclose your personal information to any external company with out your explicit permission.